The Effect of the Surface Treatment of Polyimide on Adhesion Properties of Flip Chip Package
碩士 === 國立交通大學 === 工學院半導體材料與製程設備學程 === 100 === This thesis studied the delamination failure of the interface of polyimide with the underfiller layerand other neighboring layers in Flip Chip IC assembly. We first studied process factors affecting the interface property of the polyimide and performed s...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2012
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| Online Access: | http://ndltd.ncl.edu.tw/handle/32147162965317978862 |