3D-Adaptive-ADI:A Grid-Adaptive and Integrable Thermal Simulator for 3D IC Physical Design Flow Based on ADI Method
碩士 === 國立交通大學 === 電信工程研究所 === 100 === 3D ICs, which deal with cost-effective achievement by increasing the densities of interconnection between dies, are regarded as an attractive alternative solution for overcoming the bottlenecks on 2D planar ICs. 3D ICs offer the increased system a large number o...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | en_US |
| Published: |
2011
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| Online Access: | http://ndltd.ncl.edu.tw/handle/14193209589924586902 |