Package of Bi-directional optical sub-assembly and the improvement of coupling efficiency
碩士 === 國立交通大學 === 工學院精密與自動化工程學程 === 100 === BOSA (Bi-directional Sub-Optical Assembly) mainly includes the optical transmitter module and receiver module. This paper provides a testing and packaging method for duplex module. We treat the receiver module using epoxy gel sealing packaging method and...
Main Authors: | Huang, Teng-Chien, 黃登鍵 |
---|---|
Other Authors: | Chen, Ren-Haw |
Format: | Others |
Language: | zh-TW |
Published: |
2012
|
Online Access: | http://ndltd.ncl.edu.tw/handle/95228522863336990042 |
Similar Items
-
Bi-Directional Optical Sub-Assembly Technological Study
by: Szu-Ming Chen, et al.
Published: (2006) -
Study of the Coupling Efficiency in Bi-Directional Optical Transmitter and Receiver Module
by: Dong-Yih Yu, et al.
Published: (2007) -
Analysis of Thermal Effect and the Coupling Efficiency in the Optical Sub-Assembly for Laser Diode
by: Chao-Yang Chang, et al.
Published: (2010) -
Improve Passive Alignment Optical Sub-Assembly System Package Using Flip Chip Technique
by: Kuo-Hui Yang, et al.
Published: (2004) -
Design of Optical Coupling for Bi-Directional Triplexer Transceiver Module
by: ChangJin-Sheng, et al.
Published: (2007)