Package of Bi-directional optical sub-assembly and the improvement of coupling efficiency

碩士 === 國立交通大學 === 工學院精密與自動化工程學程 === 100 === BOSA (Bi-directional Sub-Optical Assembly) mainly includes the optical transmitter module and receiver module. This paper provides a testing and packaging method for duplex module. We treat the receiver module using epoxy gel sealing packaging method and...

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Bibliographic Details
Main Authors: Huang, Teng-Chien, 黃登鍵
Other Authors: Chen, Ren-Haw
Format: Others
Language:zh-TW
Published: 2012
Online Access:http://ndltd.ncl.edu.tw/handle/95228522863336990042