Optimization of Cu wire bonding on AlCu bond pad in Electronic Package
碩士 === 國立交通大學 === 工學院精密與自動化工程學程 === 100 === Wire bonding is major inter-connect technology to connect chips to substrate in electronic package industry. Traditionally, Au & Al are preferred material for wire bond process due to inherent advantage in material properties. Stable material physical...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2012
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| Online Access: | http://ndltd.ncl.edu.tw/handle/35090695277144966445 |