Crack Formation after Thermal Cycling Tests for Sn2.3Ag Microbumps with Different Under-Bump-Metallization Structures
碩士 === 國立交通大學 === 加速器光源科技與應用碩士學位學程 === 100 === Due to the progress of packaging technology from 2-dimension to 3-dimension (3D) stacking, the decreasing in pitch of microbumps is inevitable. It was reported the intermetallic compounds (IMCs) are brittle and thus not good for 3D integrated circuit (I...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2012
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| Online Access: | http://ndltd.ncl.edu.tw/handle/47952366753963799832 |