On analyzing and Improving ESD protection in Area-I/O Flip-Chip Design
碩士 === 國立交通大學 === 電機學院電子與光電學程 === 100 === Now the demands of electrical product are multi-function, lightweight and low profile. Based on this concept, the package methods have to meet high density trend. Flip-chip is a mature technology on high density microsystem design and packaging. This structu...
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| Other Authors: | |
| Format: | Others |
| Language: | en_US |
| Published: |
2011
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| Online Access: | http://ndltd.ncl.edu.tw/handle/51145955662457181637 |