Using Design of Experiment to Improve Wafer Testing Overkill Problem-Case Study of A Wafer Testing Company

碩士 === 國立交通大學 === 管理學院工業工程與管理學程 === 100 === The development of IC(Integrated Circuits)faces small volume and high density as a result of semiconductor process technology continuously improves in recent years,wafer testing process has become especially importment in the semiconductor industry.In wafe...

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Bibliographic Details
Main Authors: Liao, Kuo-Hsing, 廖國欣
Other Authors: Yung, Chia-Chang
Format: Others
Language:zh-TW
Published: 2012
Online Access:http://ndltd.ncl.edu.tw/handle/86911553423170175187