Reliability of Flip Chip-Plastic Ball Grid Array Package
碩士 === 國立成功大學 === 機械工程學系碩博士班 === 100 === We used Mechanic APDL(ANSYS 12.0) to build three types of the leaded(Sn37Pb) and lead-free(Sn3.8Ag0.7Cu) solder of the flip-chip plastic ball grid array. These three types are: Type1 (no heat spreader and no molding compound), Type2 (added molding compound wi...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2012
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| Online Access: | http://ndltd.ncl.edu.tw/handle/54558979279914245759 |