The Studies of Improving Cu void in 65 nm BEoL Cu process
碩士 === 國立成功大學 === 電機工程學系專班 === 100 === With the rapid development of semiconductor technology, the semiconductor device continues to shrink down, and thus make the switching speed and performance of integrated circuits (IC) continue to be promoted. Bottlenecks encountered when miniature metal connec...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2012
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| Online Access: | http://ndltd.ncl.edu.tw/handle/21753916322161946673 |