| Summary: | 碩士 === 國立成功大學 === 航空太空工程學系碩博士班 === 100 === The MID (Molded interconnect device, MID) technology is different from the traditional printed circuit boards. The advantage is combing with mechanical and electrical functions in a single plastic parts, also provides the advantages of three-dimensional mesh circuit, making enhancement of the product , the appearance of pluralism and miniaturization, also effectively saves space and assembly time. Two-component injection molding of MID has the advantages of simple process, fast, low cost, easy processing, but the bonding strength between the two materials and the character of metallization is the problems of process. All structures must support external force, the structure should support and can’t fracture under loading conditions , which is the requirement of structural strength requirement. This study is using finite element software ANSYS simulation of tensile and bending, compare the PC / ABS substrate with FR4 substrate. Observe the stress of copper wire and the interface of copper wire and substrate under the axial force and uniformly load .
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