The structural strength analysis with plastic injection molding of molded interconnect devices
碩士 === 國立成功大學 === 航空太空工程學系碩博士班 === 100 === The MID (Molded interconnect device, MID) technology is different from the traditional printed circuit boards. The advantage is combing with mechanical and electrical functions in a single plastic parts, also provides the advantages of three-dimensional mes...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2012
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| Online Access: | http://ndltd.ncl.edu.tw/handle/82432562966828079677 |