Electromigration and Thermomigration Behavior of IMCs in Sn2.4Ag Flip Chip Solder Joint
碩士 === 國立成功大學 === 材料科學及工程學系碩博士班 === 100 === The present study investigated the effect of electromigration and thermomigration on the evolution of intermetallic compounds (IMCs) in the flip chip Cu/Sn2.4Ag/Cu solder joints. In this study, two joints in a set were used with different directions of ele...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2012
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| Online Access: | http://ndltd.ncl.edu.tw/handle/07245457252679599191 |