Optimal Design of 3D Stacking Chip TSV Package Reliability by Using Taguchi Method
碩士 === 國立成功大學 === 工程科學系碩博士班 === 100 === In recent years, with the increasing demand of semiconductors for the electronic products, the electronic packaging has been focused on the technology of multi-functional integration, miniaturization, high performance, low-cost and low power consumption. There...
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| Format: | Others |
| Language: | zh-TW |
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2012
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| Online Access: | http://ndltd.ncl.edu.tw/handle/93712292866248242744 |