Improvement of High-Voltage LED Arrays Using a Copper-Cup Heat Spreader
碩士 === 國立中興大學 === 材料科學與工程學系所 === 100 === In this study, the cup-shaped copper structure was developed to improve heat dissipation of high-power LEDs array module using electroplating technique. From our design and measurement, the copper surface area and thickness were optimized for cup-shaped coppe...
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2012
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| Online Access: | http://ndltd.ncl.edu.tw/handle/57907496060425888897 |