Reaction kinetics at the interface of Ni-based under bump metallization in solder joints
博士 === 國立中興大學 === 材料科學與工程學系所 === 100 === As the speed and functionality of CPUs rapidly increases in the past decades, a high density of flip-chip I/O (input/output) counts is required. By 2011, the size of flip-chip solder bumps had been approaching 1~5 µm and is expected to shrink faster than ever...
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| Format: | Others |
| Language: | en_US |
| Published: |
2012
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| Online Access: | http://ndltd.ncl.edu.tw/handle/66114682665676255354 |