Study on the temperature-related high pin count probe card thermal movement and probe-mark
碩士 === 國立中興大學 === 光電工程研究所 === 100 === Probe card using for front-end wafer testing that getting probe mark by probe tip contact with bonding pad and also getting property and yield of circuit in high or low temperature environment. Since the progress of wafer process to make pad size getting smaller...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2012
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| Online Access: | http://ndltd.ncl.edu.tw/handle/49327128739942208531 |