A Study of Electrodeposition of Copper on Au(111) Electrode by Cyclic Voltammetry and Scanning Tunneling Microscopy
碩士 === 國立中興大學 === 化學工程學系所 === 100 === Copper electrodeposition has received interests in recent years because it is an important process to fabricate interconnects in modern semiconductor architecture. Thiol molecules are common organic additives in copper plating solution, as they when coupled with...
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2012
|
| Online Access: | http://ndltd.ncl.edu.tw/handle/74113758255740054091 |