Add Thiourea for Acidic Copper System

碩士 === 明新科技大學 === 化學工程與材料科技研究所 === 100 === There were different kinds of additives used in the process of electroplating copper. The experiment focused on the effect of the electroplating procedure of copper by changing the thiourea concentration, observing the structure of the surface, rate of met...

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Bibliographic Details
Main Author: 張曉筑
Other Authors: 梁 世 明
Format: Others
Language:zh-TW
Published: 2011
Online Access:http://ndltd.ncl.edu.tw/handle/18954122324851127846

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