Add Thiourea for Acidic Copper System
碩士 === 明新科技大學 === 化學工程與材料科技研究所 === 100 === There were different kinds of additives used in the process of electroplating copper. The experiment focused on the effect of the electroplating procedure of copper by changing the thiourea concentration, observing the structure of the surface, rate of met...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2011
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| Online Access: | http://ndltd.ncl.edu.tw/handle/18954122324851127846 |