Mechanical Analysis of Vertical Probe

Mechanical Analysis of Vertical Probe

碩士 === 國立高雄應用科技大學 === 模具工程系 === 100 === For the miniaturization on IC process, the geometry of wafer test probe was gradually from the cantilever card to the vertical probe card. Therefore, the mechanics behavior of the probe (Palinery-7) and solder bump (Sn-Pb alloy, 63%-37%), the residual indentat...

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Bibliographic Details
Main Authors:	Ping-Hsiu Hsieh, 謝秉修
Other Authors:	Kao-Hua Chang
Format:	Others
Language:	zh-TW
Online Access:	http://ndltd.ncl.edu.tw/handle/41242213918551872088

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