Mechanical Analysis of Vertical Probe
碩士 === 國立高雄應用科技大學 === 模具工程系 === 100 === For the miniaturization on IC process, the geometry of wafer test probe was gradually from the cantilever card to the vertical probe card. Therefore, the mechanics behavior of the probe (Palinery-7) and solder bump (Sn-Pb alloy, 63%-37%), the residual indentat...
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Online Access: | http://ndltd.ncl.edu.tw/handle/41242213918551872088 |