Effect of Ni Addition on the Microstructures and Mechanical Properties of Sn-3.5Ag Pb-free Solder
博士 === 國立高雄應用科技大學 === 模具工程系 === 100 === The objective of this study is to evaluate the effects of adding 2wt.% Ni into Sn-3.5Ag lead free solders , with after differernt cooling rate, on the microstrucures and mechanical properties of intermetallic compound (IMC) layer . Furthermore, the solder join...
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Online Access: | http://ndltd.ncl.edu.tw/handle/35713649435575281979 |
| Summary: | 博士 === 國立高雄應用科技大學 === 模具工程系 === 100 === The objective of this study is to evaluate the effects of adding 2wt.% Ni into Sn-3.5Ag lead free solders , with after differernt cooling rate, on the microstrucures and mechanical properties of intermetallic compound (IMC) layer . Furthermore, the solder joints were isothermal aging treatment for further investigation the microstructures and mechanicl properties of IMC layer.
The experimental results show that the IMC layer thickness of Sn-3.5Ag+2Ni (wt.%) solder joints increased with againg times. In addition the Sn-3.5Ag-2Ni free lead solders with a different cooling rate have a significant effect on the IMC layer . Faster cooling rate of f Sn-3.5Ag-2Ni(wt.%) solder causes a erfined microstructure. The IMC layer thickness of Sn-3.5Ag+2Ni solder cooling in water ,after thermal againg , has a smaller growth rate with an optimal shear strength .
|
|---|