Effect of Ni Addition on the Microstructures and Mechanical Properties of Sn-3.5Ag Pb-free Solder
博士 === 國立高雄應用科技大學 === 模具工程系 === 100 === The objective of this study is to evaluate the effects of adding 2wt.% Ni into Sn-3.5Ag lead free solders , with after differernt cooling rate, on the microstrucures and mechanical properties of intermetallic compound (IMC) layer . Furthermore, the solder join...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Online Access: | http://ndltd.ncl.edu.tw/handle/35713649435575281979 |