Thermal conductivity and Dielectric properties of the PEDOT:PSS-AlN fillers reinforced Water-soluble polymers composites
碩士 === 國立高雄應用科技大學 === 化學工程與材料工程系 === 100 === With further miniaturization and increasing power of microelectronics, heat dissipation has become a critical consideration to their performance and reliability. For most modern microelectronic devices, cooling is restricted by the low thermal conductivit...
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| Format: | Others |
| Language: | zh-TW |
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| Online Access: | http://ndltd.ncl.edu.tw/handle/49549680732083219279 |