Using Vague Sets on Graphical Evaluation and Review Technique to Process Capability of Fab Etching Area

碩士 === 國立高雄應用科技大學 === 工業工程與管理系 === 100 === This article found in wafer etching process often appear complex and multiple reflow phenomenon, Wide range of products caused by the probability and time data in the process prone to ambiguity, and long-standing delays in improving this choke point,hoping...

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Bibliographic Details
Main Authors: Shih-LI Wei, 魏士力
Other Authors: Chia-Nan Wang
Format: Others
Language:zh-TW
Published: 101
Online Access:http://ndltd.ncl.edu.tw/handle/07922758988322752911