| Summary: | 碩士 === 義守大學 === 管理學院管理碩士在職專班 === 100 === The company exemplified by this study adopts “8D”(8 disciplines) method for improving their clients’ complaints over semiconductor packaging. Below are two main findings provided by this study:
1. Poor clamping in a wire bonding machine’s window clamp and heat block would make 2nd bond lift abnormal.
2. If hardening takes place after heat resistant tape has been used in a wire bonding machine’s heat block for 10 days, the heat resistant tape would lose its elasticity, and the window clamp would not be able to effectively compress inner leads tightly. This would cause inner leads to loosen, thereby rendering 2nd bond lift abnormal.
Through an 8D improvement method, this study attempted to analyze the problem which caused abnormality in 2006. The problem began to improve until end of 2011. Client complaints related 2nd bond lift had reduced from 26 lots in 2006 to 14 lots in 2007, 17 lots in 2008, 16 lots in 2009, 14 lots in 2010 and 12 lots in 2011, down 46%, 35%, 18%, 38% and 54% respectively. Abnormal 2nd bond lift problems had been effectively reduced.
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