The Study On Applying 8D Method To Customer Complaints-Semiconductor Packaging Industry For Example
碩士 === 義守大學 === 管理學院管理碩士在職專班 === 100 === The company exemplified by this study adopts “8D”(8 disciplines) method for improving their clients’ complaints over semiconductor packaging. Below are two main findings provided by this study: 1. Poor clamping in a wire bonding machine’s window clamp and hea...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2012
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| Online Access: | http://ndltd.ncl.edu.tw/handle/34001479921325024574 |