Interfacial Reactions between Lead-free Solders and Pd-Ag Conductors and Sn-Pd-Ag Ternary Phase Equilibria
碩士 === 中原大學 === 化學工程研究所 === 100 === Ag-Pd conductors are used to be the conductive materials of thick film hybrid circuit, and Sn is the primary element of the Pb-free solders. Sn/Ag-Pd soldering joints are frequently encountered in flip chip packaging of the thick film hybrid circuit. Therefore, th...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2012
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| Online Access: | http://ndltd.ncl.edu.tw/handle/75796111697991130113 |