Defect Analysis and Yield Improvement Study for the Printing Process of Multi-layer Ceramic Capacitors Using Customer Complaint Data

碩士 === 中原大學 === 工業與系統工程研究所 === 100 === Various types of electronic products focus on particular emphasis on the import compact size and low power consumption trend at the novelty change the occasion. The smaller 0201 inch components of Multilayer ceramic capacitor are under increasing demand. Lo...

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Bibliographic Details
Main Authors: Ming-Hao Hsu, 許銘浩
Other Authors: Hui-Fen Chen
Format: Others
Language:zh-TW
Published: 2012
Online Access:http://ndltd.ncl.edu.tw/handle/19354673078878263306
Description
Summary:碩士 === 中原大學 === 工業與系統工程研究所 === 100 === Various types of electronic products focus on particular emphasis on the import compact size and low power consumption trend at the novelty change the occasion. The smaller 0201 inch components of Multilayer ceramic capacitor are under increasing demand. Low yield of production and high field return rate are occurred while reduce in size but have higher capacitance. Low power consumption of non-performing model is the degree of contraction of the inner electrode layer and offset excessive lead, the key process is the electrode paste printing process. The defect mode of low capacitance is caused by high degree of contraction and offset of the inner electrode layer. In this technical report, set the W company as an example to explore the electrode paste printing process parameter settings of the MLCC 0201/X5R/0.1uF/6.3V product. The purpose is to improve yield, and reduce production cost and customer complaint frequency. Assessment of process parameters, the performance indicators used the printing uniformity and Minus standard values of printing pattern width. Under the premise of not purchase new machinery and raise the cost, decide to using 2n experimental design as method. Use the failure analysis and Cause &; Effect diagram to choose the key parameters as angle of scraper, hardness of scraper, inner electrode nickel paste, print screen, and spacing of mesh. Through the professional process engineering set for each factor as different levels as high and low then arrange the experimental combination experiments by every factors and levels. The technical report uses the statistical software Minitab to proceed 25 analysis to identify the significant factor of the printing screen gateway spacing which are with main effects and mutual interaction are significant. Finally, perform the analysis of experimental combination of professional judgment through the process engineering units based at the lowest cost and the production of a high success rate to select a printing process best production parameter conditions. angle of scraper, hardness of scraper, inner electrode nickel paste, print screen, and spacing of mesh. The scraper angle for a high standard of 80 °, scraper hardness for a high standard of 65 °, the viscosity for the inner electrode of nickel paste for the low level of 13000cps, printing screen for high standards of 640 and mesh spacing for the low level of 2mm can reduce the printing process electrical sorting out rate (defect rate) from 16% to 6%, and thus improve the whole process yield improvement for 10%, and reduce the cost about NTD 4,248,000 every year to achieve process improvement and the experimental results of parameter optimization.