Effects of Cu Substrate States and Cu6Sn5 Formation on Tin Whisker Growth
碩士 === 國立中正大學 === 化學工程研究所 === 100 === In the electronic packaging processes, surface treatment of the tin coating layer is frequently used upon leadframes and solder pads; however, the generation of tin whiskers may cause the failure of electronic components. This study investigated the sources of c...
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2012
|
| Online Access: | http://ndltd.ncl.edu.tw/handle/68288458344498201954 |