The Study of Sn-Ag-Bi/Ni Interface by Vacuum Melting

碩士 === 國立勤益科技大學 === 機械工程系 === 100 === In this study, vacuum melting and smelting of lead-free solder alloy, due to the low temperature metal solder together metal, high operating temperature above the boiling point, may evaporate leaving the solder metal content, impure. Due to rising raw material...

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Bibliographic Details
Main Authors: Chia-Hsin Cheng, 鄭佳欣
Other Authors: Ting Wang
Format: Others
Language:zh-TW
Published: 2012
Online Access:http://ndltd.ncl.edu.tw/handle/60587247594910616667