The Study of Sn-Ag-Bi/Ni Interface by Vacuum Melting
碩士 === 國立勤益科技大學 === 機械工程系 === 100 === In this study, vacuum melting and smelting of lead-free solder alloy, due to the low temperature metal solder together metal, high operating temperature above the boiling point, may evaporate leaving the solder metal content, impure. Due to rising raw material...
Main Authors: | , |
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Other Authors: | |
Format: | Others |
Language: | zh-TW |
Published: |
2012
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Online Access: | http://ndltd.ncl.edu.tw/handle/60587247594910616667 |