Simulation and Analysis on High-Frequency TSV Packaging Structure through 3D Field Solver
碩士 === 國防大學理工學院 === 電子工程碩士班 === 101 === According to the transmission line theory, the purpose of this research is to study the signal decay of the Through Silicon Via (TSV) structure in high frequency domain. In addition, based on the studies on the samples with geometric dimensions, the electric...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2013
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| Online Access: | http://ndltd.ncl.edu.tw/handle/78fqcc |