Study on correlation between wafer quality and diamond wheel material

• Main Authors: Wei-Chieh Lee, 李蔚杰
• Other Authors: 蘇 艾
• Format: Others
• Language: zh-TW
• Published: 2011
• Online Access: http://ndltd.ncl.edu.tw/handle/12627255276258886367

碩士 === 元智大學 === 機械工程學系 === 99 === One important factor in semiconductor packaging industry is chip thickness. During the process relatively thinner chip is favored in terms of technology trend. In this study, diamond wheel that used for mechanical grinding and polish for wafer thinning process is discussed, with special focus on diamond grit size, adhesive composition and post-furnace vent size. The grinding wheels used were 8000#, from major market suppliers from Japan, Korea and USA. The test items were wafer surface roughness, die strength, edge chipping, life time and spindle current loading experience. Dummy silicon wafer were exercised with standard manufacturing process recipe on commercially available grinding machine. In terms of manufacturing perspective, cost and quality are the two key aspects. How to find the balance between the two in choosing suitable wheel has always been the question, and this study is the attempt for the resolution. The result of correlation from this study in between wheel material,wafer quality and the cost. It shows "there is no the best grinding wheel but the most suitable one ". It because the diamond grit size can be the direct factors of grinding force,surface roughness,die strength and spindle current overloading experiment, and further more the adhesive composition affected the surface roughness,spindle current overloading experiment and life time of grinding wheel. There will have various effects resulted from the proportion of two different materials, and so the most important key point is how to balance the products quality and cost.