Study on correlation between wafer quality and diamond wheel material
碩士 === 元智大學 === 機械工程學系 === 99 === One important factor in semiconductor packaging industry is chip thickness. During the process relatively thinner chip is favored in terms of technology trend. In this study, diamond wheel that used for mechanical grinding and polish for wafer thinning process is di...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2011
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| Online Access: | http://ndltd.ncl.edu.tw/handle/12627255276258886367 |