Solder Reflow of Eutectic Bump
碩士 === 元智大學 === 電機工程學系 === 99 === The fluxless solder reflow has attracted great attention in bumping industry. This thesis elucidates the solder reflow of eutectic (63Sn/37Pb) solder bump using fluxless formic acid. The dependences of formic acid reflow on metallic oxide reduction are investigated...
| Main Authors: | , |
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| Format: | Others |
| Language: | en_US |
| Published: |
2011
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| Online Access: | http://ndltd.ncl.edu.tw/handle/16414073206013407857 |