Study of Wet Etching at a Patterned Sapphire Substrate by Using a SiNx Barrier Layer

碩士 === 元智大學 === 光電工程研究所 === 99 === In this study, silicon nitride is used to replace silicon dioxide as a barrier to form a patterned sapphire substrate. By etching, we obtained the result of a patterned sapphire substrate whose depth is 1181 nm. Besides, there is a fine layer of silicon nitride on...

Full description

Bibliographic Details
Main Authors: Jia-Yang Huang, 黃家揚
Other Authors: 陳念波
Format: Others
Language:zh-TW
Published: 2011
Online Access:http://ndltd.ncl.edu.tw/handle/56722254334782262225
Description
Summary:碩士 === 元智大學 === 光電工程研究所 === 99 === In this study, silicon nitride is used to replace silicon dioxide as a barrier to form a patterned sapphire substrate. By etching, we obtained the result of a patterned sapphire substrate whose depth is 1181 nm. Besides, there is a fine layer of silicon nitride on the top of the patterns. The refractive index of silicon nitride is 2.05 while that of sapphire is 1.78, and 2.4 for the GaN. Since the refractive index of silicon nitride falls between the GaN and sapphire substrates, silicon nitride can be used as the material for gradient refractive index. However, the refractive index of silicon dioxide is just 1.42, so it is not an useful material for gradient refractive index.