Power Device Contact Aluminum Wet Etch Process Study
碩士 === 國立臺北科技大學 === 有機高分子研究所 === 99 === Applications of Aluminum are used in semiconductor device as a connection between layout and also as a good ohmic contact between semiconductor surface and metal layer. Aluminum ohmic contact is related with contact area and silicide density, and it has no CD...
Main Authors: | , |
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Other Authors: | |
Format: | Others |
Language: | zh-TW |
Published: |
2011
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Online Access: | http://ndltd.ncl.edu.tw/handle/cqsz99 |