Power Device Contact Aluminum Wet Etch Process Study

碩士 === 國立臺北科技大學 === 有機高分子研究所 === 99 === Applications of Aluminum are used in semiconductor device as a connection between layout and also as a good ohmic contact between semiconductor surface and metal layer. Aluminum ohmic contact is related with contact area and silicide density, and it has no CD...

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Bibliographic Details
Main Authors: Chih-Shien Chang, 張智賢
Other Authors: 蘇昭瑾
Format: Others
Language:zh-TW
Published: 2011
Online Access:http://ndltd.ncl.edu.tw/handle/cqsz99