Parametric Design for the LED Encapsulation Process Using Viscosity Modeling of Epoxy Materials
碩士 === 國立臺北科技大學 === 工業工程與管理研究所 === 99 === Epoxy resin is current material for LED packaging process. The curing link (gel time) for epoxy resin is a crucial phenomenon, impact the fluidity and yield of modeling process. A survey of literature reveals that formed voids after the Molding Compound curi...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2011
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| Online Access: | http://ndltd.ncl.edu.tw/handle/32z388 |