Study of materials and processing technology and its influence on the properties of epoxy prepregs

• Main Authors: CHING -WEN HSIH, 謝清文
• Other Authors: 陳文章
• Format: Others
• Language: zh-TW
• Published: 2011
• Online Access: http://ndltd.ncl.edu.tw/handle/8frz9t

碩士 === 國立臺北科技大學 === 化學工程研究所 === 99 === Copper clad laminates are major components in the production of printed circuit boards. Both epoxy prepregs and copper foils are used to produce copper clad laminates through the hot compression process. In addition, the epoxy prepregs used as a bonding material for making multi-layer printed circuit boards are laminated together on many sheets of the copper substrates by thermal compression process. This paper investigates the influence of epoxy prepreg qualities and the interaction of the characteristic factors such as material formulations and manufacturing parameters. For the prepeg formulations of glass fabrics, this paper studied the material parameters of resins, fillers, solvents, and additives. For the manufacturing parameters, the coating of the impregating resins on glass fabrics and the drying of the prepegs were studied. Finally, the most suitable material formulations and the optimal processing conditions were obtained. The experimental results showed the fiber-opening glass fabrics with an increase in permeability of resins. Using a coupling-agent surface treatment with high wettability on glass fabrics makes it easier for the prepeg manufacturing. Better appearance, fewer defects and more uniform cross-linking structure of the prepregs confirmed the optimal parameters used.