Study of materials and processing technology and its influence on the properties of epoxy prepregs
碩士 === 國立臺北科技大學 === 化學工程研究所 === 99 === Copper clad laminates are major components in the production of printed circuit boards. Both epoxy prepregs and copper foils are used to produce copper clad laminates through the hot compression process. In addition, the epoxy prepregs used as a bonding materia...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2011
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| Online Access: | http://ndltd.ncl.edu.tw/handle/8frz9t |