A Patent Analysis for Exploring TSV Technology Development of 3D IC
碩士 === 南台科技大學 === 工業管理研究所 === 99 === Abstract The concept of Three Dimensional Integrated Circuits (3D ICs) has now been considered critical in the semiconductor industry. The increasing demands of high performance, low power consumption, high I/O footprints and high interconnect densities, result t...
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| Format: | Others |
| Language: | zh-TW |
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100
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| Online Access: | http://ndltd.ncl.edu.tw/handle/06303659255789371335 |