The Improvement of Plating Nodules, Whiskers, and Short Defects in Substrate Plating Process by Controlling the Concentration of Plating Addition.
碩士 === 國立高雄大學 === 電機工程學系--先進電子構裝技術產業研發碩士專班 === 99 === As the trend of the development of the electronic package technology, smaller package body size, higher speed, higher pattern density, and multi function are required. For the products which produced by tenting process cannot meet the customer r...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2010
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| Online Access: | http://ndltd.ncl.edu.tw/handle/08986141614304602746 |