Piercing of High Thickness to Diameter Ratio Holes with Multiple Operations
碩士 === 國立臺灣大學 === 機械工程學研究所 === 99 === With the ongoing market trend, there is a growing demand on micro products. In the manufacturing process of a micro part, the hole-piercing is commonly involved. Though the hole-piercing process with low thickness to diameter (t/D) ratio has been well-developed,...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2011
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| Online Access: | http://ndltd.ncl.edu.tw/handle/04683949949786566996 |