Die Bonding of Si/Ni/In with Cu/Ag Lead Frame
碩士 === 國立臺灣大學 === 材料科學與工程學研究所 === 99 === Recently, LED (Light Emitting Diode) has made a big progress. Like other electronic device, high power device have led to a movement towards LED. Because LED chip is sensitive to the temperature, thermal dissipation becomes the most important challenge to...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2011
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| Online Access: | http://ndltd.ncl.edu.tw/handle/45842995152724171349 |