An Improved IC Packaging Process for Wafer Crack
碩士 === 國立高雄第一科技大學 === 電腦與通訊工程研究所 === 99 === As the type of IC package is toward lighter, thinner and smaller, the problems about wafer crack is more important. In this research, make use of the judgment and analysis of the methods of the quality control (QC), and the relationship between polyimide a...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | en_US |
| Published: |
2011
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| Online Access: | http://ndltd.ncl.edu.tw/handle/05174998665629353172 |