Relationship between Ball Impact Test Performance of Solder Joints and Plastic Ability of Interfacial Intermetallics
碩士 === 國立東華大學 === 材料科學與工程學系 === 99 === To clarify the effect of interfacial IMCs on the mechanical reliability of solder joints, this study prepared Sn-Ag solder joints with different kinds of IMCs at interfaces using various solder alloys bonded with different substrate materials for investigating...
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2011
|
| Online Access: | http://ndltd.ncl.edu.tw/handle/30013854142748650301 |