| Summary: | 碩士 === 國立彰化師範大學 === 機電工程學系 === 99 === The purpose of this study is to evaluate the quality of the pasted thin film on the wafer surface by using Image Process Technology and the motion control system to make up the automatic optic inspect system. Design of the automatic image examination system was completed Microsoft Visual Basic 2008, and this software was used to control and drive motor turning of the wafer examination platform system. Imaging detection of distance of the wafer edge was achieved by an Image acquest device, and collection of statistics data for the database system to provide for user. The study will compare the result by use template matching in this system.
The system is instantly online and automatically detects an edge of a 12-inch wafer image. The sampling image time used 0.06 was seconds and resolution was 5.2μm/pixel. The system examines the distance of the edge between the thin film and wafer and alignment of the thin film. This alignment judges eccentricity value of the wafer and thin film Center distance. When examination is finished, the system will show some information on the computer monitor. If examination has 360 points, it can test 45 to 50 pieces of wafer per hour. If it only for the eccentricity value, the system can test more than 500 pieces of wafer per hour. This system’s error is less than 0.02mm.
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