An Application of Cluster-Based Design in 3D IC

碩士 === 國立彰化師範大學 === 資訊工程學系 === 99 === With the progress of Integrated Circuit (IC) fabrication, the amount of transistors in a IC is getting more and more. To reduce the metal layer the three-dimensional IC (3D IC) is developed to replace traditional IC (2D IC). In 3D IC, layer-to-layer uses Through...

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Bibliographic Details
Main Author: 林家守
Other Authors: 魏凱城
Format: Others
Language:zh-TW
Published: 2011
Online Access:http://ndltd.ncl.edu.tw/handle/46103837059707370212