The study of Cu-Ni thin-film bonding technique
碩士 === 國立中央大學 === 材料科學與工程研究所 === 99 === Wafer bonding is a critical processing technique in MEMS and aerospace industry. It contains several potential problems such as Creep, Relaxation and Fatigue under the tests of varieties of environmental condition due to the traditional metallurgical processin...
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2011
|
| Online Access: | http://ndltd.ncl.edu.tw/handle/38188437817182175311 |